| Laser Wavelength: 355 nm |
| Minimum Spot Size: 5 μm |
| Galvanometer Scanning Speed: 0-8000 mm/s |
| Galvanometer Repeatability: ±1 μm |
| Motion mechanism |
| XY module repeat positioning accuracy <±1μm |
| Rotary table repeat positioning accuracy 士2.5″ |
| Lifting platform repeat positioning accuracy <±1μm |
| Wafer-specific automatic loading and unloading mechanism |
| Measurement system |
| Resistance adjustment range: 10Ω–1MΩ |
| Resistance adjustment accuracy: <±0.3% |
| Standard configuration: 24 measurement channels |
| Power requirements |
| Equipment power supply: 220V, 50Hz (single-phase) |
| Air supply pressure: 0.4–0.6 Mpa |
| Ambient temperature: 24±4°C; air-conditioned constant temperature |
Discover the MT350 Series laser trimming machine designed for semiconductor wafer processing with precise trimming capabilities, visual identification, and data collection features. Available for 4″, 6″, and 8″ wafers, it offers high accuracy and efficient production.
- The MT350 Series Laser Trimming Machine is engineered for precision semiconductor wafer processing, making it ideal for applications that require high accuracy and efficiency. Compatible with 4-inch, 6-inch, and 8-inch wafers, the MT350 offers unmatched flexibility and performance. Key features include:
- Advanced Visual Identification and Positioning: Equipped with advanced visual recognition and positioning technology, the MT350 enables full wafer preview and precise trimming with flexible positioning for complex wafer designs.
- Data Collection & Yield Statistics: Provides detailed production insights, including efficiency metrics and quality tracking, helping to optimize throughput and quality control.
- Defective Product Marking: The system can automatically identify defective areas and mark them for easy exclusion, improving overall product quality and yield.
- Automatic Wafer Handling: Featuring an automated loading and unloading system, the MT350 reduces manual intervention, increasing production speed and minimizing handling errors.
- Ultra-High Precision: Leveraging high-speed scanning galvanometers and precision modules, the MT350 achieves trimming accuracy of <±0.3%, ensuring the highest standard of precision.
- 355 nm Laser Source: Standard with a 355 nm laser, but customizable with other laser types (e.g., UV or fiber lasers) to meet specific application needs.
- GBIP Expansion Interface: With the GBIP expansion interface, the MT350 can connect to external measurement devices, offering greater flexibility and functionality for diverse trimming applications.
Optimize your semiconductor production with the MT350 Series, designed for precision, accuracy, and efficiency in wafer trimming. Whether you’re processing standard wafers or specialized materials, the MT350 delivers high-performance results.
